Download Microvias: For Low Cost, High Density Interconnects by John H. Lau,Ricky S.W. Lee PDF
By John H. Lau,Ricky S.W. Lee
State-of-the-art advent to high-density interconnect technology
The first-ever publication in this sizzling subject, Microvias: good value, excessive Density Interconnects promises an intensive examine the know-how that’s altering the character of revealed circuit boards--and riding the cellular digital revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s extensive advent to microvia know-how expertly covers all significant options. You get very important information on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. you furthermore may get a survey of the paintings of major businesses and their items, together with Canon, Compaq, Fujitsu constrained, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.
Read or Download Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) PDF
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