Download Introduction to Multichip Modules by Naveed A. Sherwani,Qiong Yu,Sandeep Badida PDF

By Naveed A. Sherwani,Qiong Yu,Sandeep Badida

the 1st entire textual content for the new new multichip module expertise

Introduction to Multichip Modules is the 1st booklet to supply a accomplished advent to the know-how of MCM-based digital packaging—an innovation that has introduced great advancements in functionality to computing platforms of all kinds.

A easy textual content and a pro reference in a single, this booklet explores parts of relevance in either electric engineering and machine technology. It comes entire with evaluation- and research-oriented difficulties, an in depth bibliography, and over a hundred illustrations.

Useful and instructive in lots of methods, advent to Multichip Modules:

  • Discusses the advantages in addition to the issues bobbing up from the compact packaging layout of MCMs
  • Presents technical fabric in a scientific method, and vitamins it with details on business advancements and applications
  • Compares prior digital packaging with the recent know-how in its dialogue of the evolution of MCMs
  • Includes fabric correct to diversified commercial segments, similar to thermal administration teams, CAD teams, electric simulation, and interconnect research groups
  • Provides broad technical info for designers of MCMs and MCM-based structures, whereas appearing as a brief reference for CAD engineers concerned with instrument layout for this technology.

Ideal for college classes, creation to Multichip Modules can be utilized in complicated subject matters periods or examine classes in multichip modules, digital packaging, or CAD instruments for MCMs.

Multichip modules (MCMs) characterize the newest in packaging expertise for high-performance computing structures. constructed based on advances in built-in circuit know-how, in particular VLSI applied sciences, MCMs' compact layout of naked chips on multichip modules presents stronger procedure functionality and reliability, elevated working velocity, and diminished process dimension and weight. while, this layout offers its personal set of demanding situations and difficulties not like something in conventional, single-chip-module digital packaging. those contain extra warmth, digital noise, and new digital phenomena taking place at larger working frequencies.

Introduction to Multichip Modules is the 1st ebook to supply entire assurance of the fundamentals of this new expertise for college students and execs alike. It covers all elements of MCM, together with category, layout, and CAD instruments, and explains equipment and fabrics utilized in the layout of MCM-based platforms. This e-book additionally examines the benefits and drawbacks of varied forms of layout; demonstrates tools of bettering approach reliability; and discusses some great benefits of MCMs over conventional packaging tools for electronic-based functions in pcs, aviation, and the army. advent to Multichip Modules discusses either customized equipped MCMs and programmable MCMs and their position in decreasing fee and enhancing turnaround time.

An useful source for college students and pros in electric engineering who layout MCMs and MCM-based structures, and for these in machine technology who boost CAD instruments for MCMs, this ebook can be priceless to someone who want to understand extra in regards to the evolution of this expertise and the place the hot advances within the box could lead on us.

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